SY88923AVKG-TR Microchip Technology
Here is a potential introduction for the Siemens SY88923AVKG-TR module:
SY88923AVKG-TR
The SY88923AVKG-TR is an industrial-grade edge AI computing module suited for applications requiring powerful heterogeneous processing, modular connectivity and validation over extended operational lifetimes under harsh industrial conditions.
Key Features:
- NVIDIA Jetson TX2 module with 256-core Pascal GPU
- Quad-core ARM 57 CPU up to 2.0GHz
- Multiple certified modular I/O interfaces
- Extended operating temp from -40°C to 70°C
- 15-year component availability
- Secure over-the-air updates
Designed for demanding AIoT applications in manufacturing demanding processing power, modular integration and longevity validation under severe environments.
Combines NVIDIA's Edge AI performance with customizable connectivity, ultra-wide temperature support and a 15-year product life cycle commitment.
Ideal for applications imposing intensive AI/vision, I/O and thermal loads through adaptable integration sustained over decades.
Simplifies developing scalable, trusted solutions optimized for continuous evolution via modular interface changes.
Ensures long-term validated support, security updates and services to enable over 15 years of innovation for Industry 4.0.
Enables deploying and sustaining customized modular AI platforms tightly integrated across automated equipment and plants.
Streamlines flexible, reliable integration and lifetime maintenance of specialized systems for AI-enabled automation and predictive maintenance.

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MCP6V86T-E/OTVAO Microchip Technology |
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MCP6541RT-I/OTVAO Microchip Technology |
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MCP6V81UT-E/LTYVAO Microchip Technology |
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MCP6477T-E/MSVAO Microchip Technology |
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MCP6496UT-E/LTVAO Microchip Technology |
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MCP6486T-E/OTVAO Microchip Technology |
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MCP6499T-E/SLVAO Microchip Technology |
MCP6499T-E/SLVAO Microchip Technology
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