W25M512JVEIQ Winbond Multichip Packages Memory & Data Storage
Specifications
Base Product Number:
DAC8228
Number Of Circuits:
4
Digikey Programmable:
Not Verified
Amplifier Type:
Zero-Drift
Package Type:
Surface Mount, Through Hole
Type:
Floating Point
Synchronous Rectifier:
No
Supplier Device Package:
16-MSOP-EP
Series:
Blackfin®
Mfr:
Analog Devices Inc.
Connectivity:
I²C, SPI, UART/USART
Operating Temperature Range:
-40°C To +125°C
Control Features:
Enable
Mounting Type:
Through Hole
Highlight:
W25M512JVEIQ
,Winbond Multichip Packages
,Memory Data Storage Multichip Packages
Model Number:
W25M512JVEIQ
Introduction
| Winbond | |
| Product Category: | Multichip Packages |
| RoHS: | |
| Serial NOR Flash | |
| 512 Mbit | |
| WSON-8 | |
| W25M512JV | |
| SMD/SMT | |
| 104 MHz | |
| - 40 C | |
| + 85 C | |
| Brand: | Winbond |
| Data Bus Width: | 8 bit |
| Interface Type: | SPI |
| Moisture Sensitive: | Yes |
| Organization: | 64 M x 8 |
| Packaging: | Tube |
| Product Type: | Multichip Packages |
| 63 | |
| Subcategory: | Memory & Data Storage |
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